Cocktail layer over gate dielectric layer of fet feram

ABSTRACT

In some embodiments, the present disclosure relates to an integrated chip that includes a gate electrode arranged over a substrate. A gate dielectric layer is arranged over the gate electrode, and an active structure is arranged over the gate dielectric layer. A source contact and a drain contact are arranged over the active structure. The active structure includes a stack of cocktail layers alternating with first active layers. The cocktail layers include a mixture of a first material and a second material. The first active layers include a third material that is different than the first and second materials. The bottommost layer of the active structure is one of the cocktail layers.

REFERENCE TO RELATED APPLICATION

This application is a Divisional of U.S. application Ser. No.17/168,342, filed on Feb. 5, 2021, the contents of which are herebyincorporated by reference in their entirety.

BACKGROUND

Many modern day electronic devices include non-volatile memory.Non-volatile memory is electronic memory that is able to store data inthe absence of power. A promising candidate for the next generation ofnon-volatile memory is ferroelectric random-access memory (FeRAM). FeRAMhas a relatively simple structure and is compatible with complementarymetal-oxide-semiconductor (CMOS) logic and thin film transistorfabrication processes.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 illustrates a cross-sectional view of some embodiments of a fieldeffect transistor (FET) ferroelectric random access memory (FeRAM)device comprising a cocktail layer directly on a ferroelectric layer.

FIG. 2 illustrates a magnified, cross-sectional view of some embodimentsof the microstructure of the cocktail layer.

FIGS. 3A and 3B illustrate cross-sectional views of some alternativeembodiments of a FET FeRAM comprising a cocktail layer directly on aferroelectric layer.

FIG. 4 illustrates a cross-sectional view of some embodiments of anintegrated chip comprising a FET FeRAM embedded within an interconnectstructure.

FIGS. 5-15 illustrate various views and schematics of some embodimentsof methods to form a cocktail layer on a ferroelectric layer of a FETFeRAM.

FIG. 16 illustrates a flow diagram of some embodiments of methods offorming a cocktail layer in a FET FeRAM that corresponds to the methodsillustrated in FIGS. 5-15.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

A thin film transistor (TFT) is a type of field effect transistor (FET)that includes an active layer that may be turned “ON” such that mobilecharge carriers flow through the active layer when a sufficient signal(e.g., voltage, current) is applied to source contact, drain contact,and gate electrode of the TFT. In some instances, the active layercomprises a semiconductor material that is transparent such as, forexample, indium gallium zinc oxide (IGZO), amorphous silicon, or someother suitable material for use in optical applications. In a bottomgate TFT, the gate electrode is arranged below the active layer and thesource and drain contacts are arranged over the active layer. A gatedielectric layer may separate the gate electrode from the active layer.In some instances, the gate dielectric layer comprises a ferroelectricmaterial, such that the TFT functions as a FET ferroelectric randomaccess memory (FeRAM). The ferroelectric layer can store data valuesbased on a process of reversible switching between polarizations statesbecause the ferroelectric's crystal structure changes when an electricfield is present.

To form a FET FeRAM, a ferroelectric layer is formed over a gateelectrode. Then, the active layer is formed over the ferroelectriclayer, and source and drain contacts are formed over the active layer.In some embodiments, the active layer comprises multiple layers ofmaterials that have different optimal properties when disposed directlyon the ferroelectric layer. For example, when the active layer comprisesIGZO, a layer of gallium oxide may be formed directly on theferroelectric layer because gallium oxide has a high bonding energywhich reduces defects (e.g., oxygen vacancies). With a reduction indefects (e.g., oxygen vacancies), less positive or negative charges,known as surface states, will be created within the active layer and/orferroelectric layer, thereby reducing reliability concerns. However, areduction in defects (e.g., oxygen vacancies) also reduces chargemobility in the layer of gallium oxide. So, in some other embodiments, alayer of indium oxide, which has a higher mobility than gallium oxide,is formed directly on the ferroelectric layer to increase the switchingspeed of the FET FeRAM. However, reliability is reduced when indiumoxide is formed directly on the ferroelectric layer because more surfacestates are formed compared to that of gallium oxide.

Various embodiments of the present disclosure relate to forming anactive structure over a ferroelectric layer of a FET FeRAM, wherein theactive structure comprises a cocktail layer arranged directly on theferroelectric layer to increase charge mobility while also decreasingsurface states of the ferroelectric layer and/or cocktail layer. Thecocktail layer comprises a mixture of a first material and a secondmaterial, wherein the first material has a stronger bonding energycompared to the second material to reduce surface states, and whereinthe second material has a higher charge mobility compared to the firstmaterial to increase switching speeds. In some embodiments, the cocktaillayer is formed by activating precursors of the first and secondmaterials at the same time within a same reaction chamber. Thus, thecocktail layer is formed directly on the ferroelectric layer such thatthe first and second materials contact the ferroelectric layer tooptimize switching speeds and reliability of the FET FeRAM.

FIG. 1 illustrates a cross-sectional view 100 of some embodiments of afield effect transistor (FET) ferroelectric random access memory (FeRAM)device comprising a cocktail layer directly on a ferroelectric layer.

The cross-sectional view 100 of FIG. 1 includes a gate electrode 106arranged over a substrate 102. In some embodiments, a dielectric layer104 is arranged between the gate electrode 106 and the substrate 102. Insome embodiments, a gate dielectric layer 108 is arranged over the gateelectrode 106. In some embodiments, the gate dielectric layer 108comprises a ferroelectric material such as, for example, strontiumbismuth tantalite, lead zirconate titanate, hafnium zinc oxide, hafniumzirconium oxide, doped hafnium oxide, or the like. In such embodiments,the gate dielectric layer 108 comprising the ferroelectric material isconfigured to store data states by changing crystal structureorientations and thus, resistances upon exposure to different voltagebiases.

In some embodiments, an active structure 110 is arranged over the gatedielectric layer 108. In some embodiments, the active structure 110comprises a semiconductor material that can be turned “ON” to form achannel region of mobile charge carriers when a sufficient voltage biasis applied across the active structure 110. The channel region of mobilecharge carriers can be controlled to read data from or write data to thegate dielectric layer 108. In some embodiments, a bottommost layer 110 bof the active structure 110 comprises a cocktail layer 112 comprising amixture of first and second materials, and a first active layer 114comprising a third material different than the first and secondmaterials is arranged over the cocktail layer 112. In some embodiments,the active structure 110 comprises a stack of the cocktail layers 112and the first active layers 114 in alternating order. In someembodiments, a topmost layer 110 t of the active structure 110 comprisesone of the first active layers 114.

In some embodiments, source/drain contacts 118 are arranged over theactive structure 110. In some embodiments, the source/drain contacts 118are arranged within and extend through an interconnect dielectric layer116 to contact the topmost layer 110 t of the active structure 110.

In some embodiments, the first, second, and third materials of theactive structure 110 are metal-oxides. In some embodiments, the thirdmaterial of the first active layer 114 comprises a more crystallinematerial than the first and second materials. Thus, the first activelayer 114 is spaced apart from direct contact with the gate dielectriclayer 108 because otherwise, an interface between the third material ofthe first active layer 114 and the gate dielectric layer 108 would betoo rough and have potential adhesion and structural issues on the gatedielectric layer 108.

In some embodiments, the first material of the cocktail layer 112comprises a stronger or more negative bonding energy than the secondmaterial. In some embodiments, the bonding energy may be determined froma metal oxide Ellingham diagram, which illustrates the Gibbs free energyof formation versus temperature for various metal-oxides. In someembodiments, the first material comprises gallium oxide, hafnium oxide,zirconium oxide, titanium oxide, aluminum oxide, tantalum oxide,strontium oxide, barium oxide, scandium oxide, magnesium oxide,lanthanum oxide, gadolinium oxide, or some other suitable metal oxide.In some embodiments, the second material comprises indium oxide, tinoxide, arsenic oxide, zinc oxide, or the like. In some embodiments, thethird material comprises zinc oxide. Thus, for example, in someembodiments, the first material comprises gallium oxide; the secondmaterial comprises indium oxide; and the third material comprises zincoxide, such that the active structure 110 comprises indium gallium zincoxide (IGZO), which is a semiconducting material. In some otherembodiments, the active structure 110 may comprise tin gallium zincoxide, indium hafnium zinc oxide, or some other suitable combination ofthe first, second, and third materials that together form asemiconducting material.

Because the first material has a stronger bonding energy, less defects(e.g., oxygen vacancies) and thus, less surface states (i.e., excesscharges) are present at an interface between the first material of thecocktail layer 112 and the gate dielectric layer 108. In someembodiments, the second material of the cocktail layer has a highermobility than the first material of the cocktail layer 112 due to aweaker bond energy and an increase in metal ions in the second material.Thus, mobile charge carriers may have a higher mobility at an interfacebetween the second material of the cocktail layer 112 and the gatedielectric layer 108.

For these reasons, the cocktail layer 112 comprises a mixture of thefirst and second materials to reduce defects but also increase chargemobility at an interface between the bottommost layer 110 b of theactive structure 110 and the gate dielectric layer 108 to increase thereliability and switching speeds of the FET FeRAM.

FIG. 2 illustrates a magnified, cross-sectional view 200 of someembodiments of the microstructure of the cocktail layer. Thecross-sectional view 200 may correspond to box A of FIG. 1.

As shown in cross-sectional view 200, in some embodiments, the cocktaillayer 112 comprises first material regions 202 and second materialregions 204. In some embodiments, the second material regions 204 appearto be embedded within the first material regions 202. In otherembodiments, the first material regions 202 may appear to be embeddedwithin the second material regions 204. Nevertheless, in someembodiments, the cocktail layer 112 includes a mixture of the first andsecond materials, and the magnified, cross-sectional view 200 mayexhibit defined first material regions 202 comprising the first materialand second material regions 204 comprising the second material.

In some such embodiments, the first material regions 202 aresubstantially amorphous, and the second material regions 204 aresubstantially amorphous. With the first and second material regions 202,204 being amorphous, roughness and electron scattering are reduced atthe interface between the cocktail layer 112 and the gate dielectriclayer (108 of FIG. 1). Further in some embodiments, because the firstmaterial regions 202 and the second material regions 204 directlycontact the gate dielectric layer (108 of FIG. 1), defects are reducedand charge mobility is increased which increases the “ON” current andthe switching speeds of the FET FeRAM.

FIG. 3A illustrates a cross-sectional view 300A of some alternativeembodiments of a FET FeRAM comprising a cocktail layer directly on aferroelectric layer.

In some embodiments, the substrate 102 comprises a silicon on insulatorsubstrate such that the dielectric layer 104 is arranged between a bulksubstrate layer 302 and an active substrate layer 304. In someembodiments, the topmost layer 110 t of the active structure 110comprises one of the cocktail layers 112. Further, it will beappreciated that the active structure 110 may comprise more or lesslayers than what is illustrated in FIG. 3A.

In some embodiments, the gate dielectric layer 108 has a first thicknesst₁ in a range of between, for example, approximately 5 nanometers andapproximately 20 nanometers. In some embodiments, the active structure110 may have a second thickness t₂ in a range of between, for example,approximately 5 nanometers and approximately 15 nanometers. In someembodiments, each cocktail layer 112 has a third thickness t₃ in a rangeof between, for example, approximately 0.1 angstroms to approximately500 angstroms. In some embodiments, a ratio of the first material to thesecond material ranges from approximately 0.1 to approximately 0.99 inthe cocktail layer 112. In some embodiments, the gate electrode 106 maycomprise, for example, titanium nitride, aluminum, tungsten, copper, orsome other suitable conductive material. In some embodiments, the gateelectrode 106 may have a thickness in a range of between, for example,approximately 10 nanometers and approximately 20 nanometers. In someembodiments, the source/drain contacts 118 may comprise, for example,aluminum, tungsten, copper, tantalum, titanium, or some other suitableconductive material.

FIG. 3B illustrates a cross-sectional view 300B of some otheralternative embodiments of a FET FeRAM comprising a cocktail layerdirectly on a ferroelectric layer.

In some embodiments, the bottommost layer 110 b of the active structure110 comprises the cocktail layer 112. In some embodiments, the firstactive layer 114 comprising the third material is arranged over thecocktail layer 112. Then, in some embodiments, the active structure 110further comprises a second active layer 310 arranged over the firstactive layer 114, and a third active layer 312 arranged over the secondactive layer 310. In some such embodiments, the second active layer 310comprises the first material, and the third active layer 312 comprisesthe second material. Thus, in some embodiments, the cocktail layer 112is formed directly on the gate dielectric layer 108, but all otherlayers of the active structure 110 comprise the first, second, and thirdactive layers 114, 310, 312, which are homogenous layers and not layerscomprising a mixture of materials. In some such embodiments, the activestructure 110 comprises multiple ones of the first, second, and thirdactive layers 114, 310, 312 arranged over the cocktail layer 112. Insome embodiments, the topmost layer 110 t of the active structure 110may comprise the first, second, or third active layer 114, 310, 312.

FIG. 4 illustrates a cross-sectional view 400 of some embodiments of anintegrated chip comprising a FET FeRAM embedded within an interconnectstructure.

In some embodiments, the FET FeRAM is arranged within an interconnectstructure 402 that is arranged over the substrate 102. In someembodiments, the interconnect structure 402 comprises interconnectcontacts 418 and interconnect wires 408 disposed within interconnectdielectric layers 116 and etch stop layers 406. In some embodiments, theinterconnect contacts 418 and the interconnect wires 408 may comprise,for example, aluminum, tungsten, copper, tantalum, titanium, or someother suitable conductive material. In some embodiments, theinterconnect dielectric layers 116 may comprise, for example, a nitride(e.g., silicon nitride, silicon oxynitride), a carbide (e.g., siliconcarbide), an oxide (e.g., silicon oxide), borosilicate glass (BSG),phosphoric silicate glass (PSG), borophosphosilicate glass (BPSG), alow-k oxide (e.g., a carbon doped oxide, SiCOH), or the like. In someembodiments, the etch stop layers 406 may comprise, for example, siliconcarbide, silicon nitride, or some other suitable dielectric material.

As shown in FIG. 4, a first FET FeRAM 404 a and a second FET FeRAM 404 bare arranged within the interconnect structure 402. In some embodiments,the interconnect contacts 418 are arranged over and coupled to theactive structure 110 such that the interconnect contacts 418 serve asthe source/drain contacts (118 of FIG. 3) of the FET FeRAM. In someembodiments, as shown with the first FET FeRAM 404 a, the gate electrode106 is arranged over one of the interconnect wires 408. In otherembodiments, the gate electrode 106 may be arranged over one of theinterconnect contacts 418. In some embodiments, as shown with the secondFET FeRAM 404 b, the gate electrode 106 is omitted, and instead, thegate dielectric layer 108 is arranged directly on one of theinterconnect wires 408 of the interconnect structure 402.

In some embodiments, due to the small vertical dimensions of the FETFeRAMs (e.g., 404, 404 b), the FET FeRAMs may be integrated into theinterconnect structure 402 of an integrated chip and controlled by thenetwork of interconnect wires 408 and interconnect contacts 418 of theinterconnect structure 402 to store data within the gate dielectriclayers 108.

FIGS. 5-15 illustrate various views and schematics 500-1500 of someembodiments of methods of forming a cocktail layer directly on aferroelectric layer in a FET FeRAM to increase switching speeds andreliability of the FET FeRAM. Although FIGS. 5-15 are described inrelation to a method, it will be appreciated that the structuresdisclosed in FIGS. 5-15 are not limited to such a method, but insteadmay stand alone as structures independent of the method.

As shown in cross-sectional view 500 of FIG. 5, in some embodiments, agate electrode 106 is formed over a substrate 102. In variousembodiments, the substrate 102 may comprise any type of semiconductorbody (e.g., silicon/CMOS bulk, SiGe, SOI, etc.) such as a semiconductorwafer or one or more die on a wafer, as well as any other type ofsemiconductor and/or epitaxial layers formed thereon and/or otherwiseassociated therewith. In some other embodiments, the substrate 102 maycomprise a support transparent material, such as a glass, for use inoptical applications. In the cross-sectional view 500 of FIG. 5, thesubstrate 102 is a silicon-on-insulator (SOI) substrate comprising adielectric layer 104 arranged over a bulk substrate layer 302 andarranged below an active substrate layer 304. In some such embodiments,the bulk substrate layer 302 and the active substrate layer 304 maycomprise, for example, silicon, germanium, or some other suitablesemiconductor material. In some embodiments, the dielectric layer 104comprises silicon dioxide, silicon oxynitride, or some other suitabledielectric layer.

In some embodiments, the gate electrode 106 is formed over the substrate102 by way of a deposition process (e.g., physical vapor deposition(PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD),direct current sputtering, etc.). In some embodiments, the gateelectrode 106 comprises titanium nitride, aluminum, tungsten, copper, orsome other suitable conductive material. In some embodiments, the gateelectrode 106 is formed to have a thickness in a range of between, forexample, approximately 10 nanometers and approximately 20 nanometers.

As shown in cross-sectional view 600 of FIG. 6, in some embodiments, agate dielectric layer 108 is formed over the gate electrode 106. In someembodiments, the gate dielectric layer 108 is formed by atomic layerdeposition in a chamber at a temperature in a range of between, forexample, approximately 200 degrees Celsius and approximately 400 degreesCelsius. In some other embodiments, the gate dielectric layer 108 isformed by way of another deposition process (e.g., PVD, CVD, etc.). Insome embodiments, the gate dielectric layer 108 comprises aferroelectric material such as, for example, strontium bismuthtantalite, lead zirconate titanate, hafnium zinc oxide, hafniumzirconium oxide, doped hafnium oxide, or the like. For example, in someembodiments, the gate dielectric layer 108 comprises hafnium zirconiumoxide, wherein an atomic ratio between hafnium and zirconium isapproximately one to one. In some embodiments, the gate dielectric layer108 has a first thickness t₁ that is in a range of between approximately5 nanometers and approximately 20 nanometers.

As shown in cross-sectional view 700A of FIG. 7A, in some embodiments,the substrate 102 is transferred onto a wafer chuck 701 within areaction chamber defined by chamber housing 702. In some embodiments,the reaction chamber is an atomic layer deposition (ALD) chamber, lowpressure vessel, and/or the like. In some embodiments, the substrate 102was already in the reaction chamber during the formation of the gateelectrode 106 and/or gate dielectric layer 108 formed in FIGS. 5 and 6,respectively. In some embodiments, a first gas inlet line 708 passesthrough the chamber housing 702 such that a first precursor vesseldefined by first vessel housing 710 is coupled to the reaction chamberthrough the first gas inlet line 708. In some embodiments, a second gasinlet line 714 passes through the chamber housing 702 such that anoxygen source 716 can enter the reaction chamber. In some embodiments, agas outlet line 717 passes through the chamber housing 702 such thatvarious gases can exit the reaction chamber during deposition processes.

In some embodiments, a first precursor plate 704 is arranged within thefirst precursor vessel. In some embodiments, the first precursor plate704 comprises a solid precursor mixture 706 within grooves of the firstprecursor plate 704. In some embodiments, an inert gas source 712 iscoupled to the first precursor vessel such that when the inert gassource 712 is turned “ON,” the inert gas may react with the solidprecursor mixture 706, and a precursor vapor may enter the reactionchamber through the first gas inlet line 708 to form a layer from theprecursor vapor on the gate dielectric layer 108.

In some embodiments, the solid precursor mixture 706 comprises a firstprecursor mixed with a second precursor, wherein the first precursorcorresponds to a first material to be deposited onto the gate dielectriclayer 108, and wherein the second precursor corresponds to a secondmaterial to be deposited onto the gate dielectric layer 108. Thus, uponactivation of the solid precursor mixture 706, a cocktail layer (e.g.,112 in FIG. 10A) comprising a mixture of the first and second materialsmay be deposited on the gate dielectric layer 108. In some embodiments,the first material comprises gallium, hafnium, zirconium, titanium,aluminum, tantalum, strontium, barium, scandium, magnesium, lanthanum,gadolinium, or some other suitable metal. In some embodiments, whereinthe first material comprises gallium, the first precursor of the solidprecursor mixture 706 may comprise, for example, Ga(C₂H₅)₃, Ga(NMe)₃,Ga(C₅H₇O₂)₃, GaCp*, Ga(CH₃)₃, Ga₂(NMe₂)₆, or some other suitable solidprecursor comprising gallium.

In some embodiments, the second material comprises indium, tin, zinc,arsenic, or some other suitable metal. In some such embodiments, whereinthe second material comprises indium, the second precursor of the solidprecursor mixture 706 may comprise, for example, trimethyl-indium,triethyl-indium, InCp(C₅H₅In), InCA-1(C₈H₂₄InNSi₂), DADI(C₇H₁₈InN), orsome other suitable solid precursor comprising indium. In someembodiments, a ratio of the first precursor to the second precursor inthe solid precursor mixture 706 may be in a range of between, forexample, about 0.01 and about 0.99.

FIG. 7B illustrates cross-sectional view 700B of some other embodimentsof a reaction chamber defined by chamber housing 702. In some otherembodiments, the substrate 102 is transferred into the chamber housing702 of FIG. 7B instead of the chamber housing 702 of FIG. 7A.

It will be appreciated that two different methods for deposition of acocktail layer will be illustrated in FIGS. 7A-9B. The first method,comprising a solid precursor mixture (706 of FIG. 7A) will beillustrated in the “A” figures (i.e., FIGS. 7A, 8A, 9A). The secondmethod, comprising a first solid precursor 722 and a second solidprecursor 726 will be illustrated in the “B” figures (i.e., FIGS. 7B,8B, 9B). Thus, in some embodiments, a first method to deposit a cocktaillayer over the gate dielectric layer 108 follows FIGS. 7A, 8A, and 9A,whereas a second method to deposit a cocktail layer over the gatedielectric layer 108 follows FIGS. 7B, 8B, and 9B.

As shown in the cross-sectional view 700B of FIG. 7B, in someembodiments, a second precursor vessel defined by a second vesselhousing 718 is also coupled to reaction chamber defined by the chamberhousing 702. In some such embodiments, the inert gas source 712 iscoupled to the first and second precursor vessels. In some otherembodiments, each of the first and second precursor vessels are coupledto and controlled by individual gas sources. In some embodiments, asecond precursor plate 720 is arranged within the first precursor vesseland comprises a first solid precursor 722. In some embodiments, thefirst solid precursor 722 comprises the first precursor as describedabove with respect to FIG. 7A. In some embodiments, a third precursorplate 724 is arranged within the second precursor vessel and comprises asecond solid precursor 726. In some embodiments, the second solidprecursor 726 comprises the second precursor as described above withrespect to FIG. 7A.

In some such embodiments, the inert gas source 712 is coupled to thefirst and second precursor vessels such that when the inert gas source712 is turned “ON,” the inert gas may react with the first solidprecursor 722 and the second solid precursor 726 at the same time, and aprecursor vapor may from within the reaction chamber to form a layerfrom the precursor vapor on the gate dielectric layer 108. In some otherembodiments (not shown), a first inert gas source and a second inert gassource coupled to the first precursor vessel and the second precursorvessel may be turned “ON” at the same time such that precursor vaporsfrom the first and second precursor vessel enter the reaction chamberthrough the first gas inlet line 708 to form a layer from the precursorvapor on the gate dielectric layer 108.

As shown in cross-sectional view 800A of FIG. 8A, in some embodiments,the inert gas source 712 is turned “ON,” as indicated by arrows 802, andreacts with the solid precursor mixture 706 within the first precursorvessel. In some such embodiments, a precursor vapor forms and enters thereaction chamber to form a first metal layer 804 comprising a mixture oftwo metals arranged over the gate dielectric layer 108 by ALD. In someembodiments, the inert gas source 712 comprises, for example, nitrogengas, argon gas, hydrogen gas, a combination thereof, or some othersuitable gas.

As shown in cross-sectional view 800B of FIG. 8B, in some embodiments,the inert gas source 712 is turned “ON,” as indicated by arrows 802, andreacts with the first solid precursor 722 and the second solid precursor726 and a first precursor vapor from the first solid precursor 722 and asecond precursor vapor from the second solid precursor enter and mixwithin the reaction chamber. In some such embodiments, the first andsecond precursor vapors mix within the reaction chamber to form thefirst metal layer 804 comprising a mixture of two metals arranged overthe gate dielectric layer 108 by ALD.

As shown in cross-sectional views 900A and 900B of FIGS. 9A and 9B,respectively, in some embodiments, the oxygen source 716 is turned “ON,”as indicated by arrow 902, and an oxygen vapor enters the reactionchamber. In some such embodiments, the oxygen vapor then reacts with thefirst metal layer (804 of FIG. 8A or 8B) to oxidize the first metallayer (804 of FIG. 8A or 8B) and form a cocktail layer 112 over the gatedielectric layer 108. In some embodiments, the oxygen source 716 iswater, for example. In some other embodiments, the precursor vapor ofFIG. 7A or 7B enters the reaction chamber and then the oxygen vaporenters the reaction chamber and reacts with the precursor vapor to formthe cocktail layer 112, thereby bypassing the formation of the firstmetal layer (804 of FIG. 8A or 8B).

Nevertheless, in some embodiments, the cocktail layer 112 comprises amixture of the first material and a second material, wherein the firstand second materials are metal oxides. In some embodiments, the firstmaterial of the cocktail layer 112 comprises a stronger or more negativebonding energy than the second material. In some embodiments, the firstmaterial comprises gallium oxide, hafnium oxide, zirconium oxide,titanium oxide, aluminum oxide, tantalum oxide, strontium oxide, bariumoxide, scandium oxide, magnesium oxide, lanthanum oxide, gadoliniumoxide, or some other suitable metal oxide. In some embodiments, thesecond material comprises indium oxide, tin oxide, arsenic oxide, zincoxide, or the like.

In some embodiments, the cocktail layer 112 has a third thickness t₃ ina range of between, for example, approximately 0.1 angstroms toapproximately 500 angstroms. In some embodiments, a ratio of the firstmaterial to the second material in the cocktail layer 112 ranges fromapproximately 0.1 to approximately 0.99.

Because the first material has a stronger bonding energy, less defects(e.g., oxygen vacancies) and thus, less surface states (i.e., excesscharges) are present at an interface between the first material of thecocktail layer 112 and the gate dielectric layer 108. In someembodiments, the second material of the cocktail layer has a highermobility than the first material of the cocktail layer 112 due to aweaker bond energy and an increase in metal ions in the second material.Thus, mobile charge carriers may have a higher mobility at an interfacebetween the second material of the cocktail layer 112 and the gatedielectric layer 108. Therefore, the cocktail layer 112 comprises amixture of the first and second materials to reduce defects but alsoincrease charge mobility at an interface between the bottommost layer110 b of the active structure 110 and the gate dielectric layer 108.

As shown in cross-sectional view 1000 of FIG. 10, in some embodiments, afourth precursor plate 1004 is placed in the first precursor vesseldefined by the first vessel housing 710. It will be appreciated thatFIG. 10 may proceed from FIG. 9A or FIG. 9B. In some other embodiments,the fourth precursor plate 1004 may be arranged in a third precursorvessel (not shown) separate from the first and second precursors. Insome embodiments wherein there is a first vessel housing 710 and asecond vessel housing (718 of FIG. 9B) as illustrated in FIG. 9B, thesecond vessel housing (718 of FIG. 9B) is emptied and/or closed off,such that the inert gas source 712 will only activate a third solidprecursor 1006 arranged within the fourth precursor plate 1004. In someembodiments, the third solid precursor 1006 may comprise zinc or someother metal. In some embodiments, the third solid precursor 1006comprises, for example, Zn(CH₃COO)₂, diethylzinc, dimethylzinc, zincacetate, (CH₃)Zn(OCH(CH₃)₂), or some other suitable solid precursor.

As shown in cross-sectional view 1100 of FIG. 11, in some embodiments,the inert gas source 712 is turned “ON,” as indicated by arrows 1102,and reacts with the third solid precursor 1006 within the firstprecursor vessel. In some such embodiments, a third precursor vaporforms and enters the reaction chamber to form a second metal layer 1104over the cocktail layer 112 by ALD.

As shown in cross-sectional view 1200 of FIG. 12, in some embodiments,the oxygen source 716 is turned “ON,” as indicated by arrow 1202, and anoxygen vapor enters the reaction chamber. In some such embodiments, theoxygen vapor then reacts and oxidizes with the second metal layer (1104of FIG. 11) to form a first active layer 114 over the cocktail layer112. In some other embodiments, the second precursor vapor of FIG. 11enters the reaction chamber and then the oxygen vapor enters thereaction chamber and reacts with the second precursor vapor to form thefirst active layer 114, thereby bypassing the formation of the secondmetal layer (1104 of FIG. 11). In some embodiments, the first activelayer 114 has a fourth thickness t₄ in a range of between, for example,approximately 0.1 angstroms to approximately 500 angstroms.

Nevertheless, in some embodiments, the first active layer 114 comprisesa third material different than the first and second materials, such as,for example, zinc oxide, or some other suitable metal oxide. In someembodiments, the first and second materials of the cocktail layer 112and the third material of the first active layer 114 together form asemiconductor material such as, for example, indium gallium zinc oxide(IGZO), tin gallium zinc oxide, or some other suitable metal oxidesemiconductor material. In some embodiments, the first active layer 114is spaced apart from the gate dielectric layer 108 by the cocktail layer112 because the first active layer 114 has a more crystalline structurethan the cocktail layer 112. Thus, the first active layer 114 is spacedapart from the gate dielectric layer 108 to avoid potential adhesion andstructural issues on the gate dielectric layer 108.

FIGS. 13A and 13B illustrates timing diagrams 1300A and 1300B,respectively, of some embodiments of forming the cocktail layer (112 ofFIG. 12) over the gate dielectric layer (108 of FIG. 12) and the firstactive layer (114 of FIG. 12) over the cocktail layer (112 of FIG. 12).The timing diagrams 1300A and 1300B illustrate increase in gas pressureto activate various precursors versus time. The timing diagrams 1300Aand 1300B include a legend 1302 that illustrates the activation ofprecursors. In some embodiments, the time period of each gas pulse maybe in a range of between, for example, approximately 1 millisecond toapproximately 20 minutes.

FIG. 13A illustrates the timing diagram 1300A of some embodimentscorresponding to the first method, comprising a solid precursor mixture(706 of FIG. 7A) as illustrated in FIGS. 7A, 8A, 9A, 10, 11 and 12.

As shown in the timing diagram 1300A of FIG. 13A, in some embodiments,the inert gas source (712 of FIG. 8A) is turned “ON” first to activatethe solid precursor mixture (706 of FIG. 8A) which corresponds to thesteps in FIG. 8A. Then, the oxygen source (716 of FIG. 9A) is turned“ON” after the inert gas source (712 of FIG. 8A) to introduce oxygenvapor into the reaction chamber to form the cocktail layer (112 of FIG.9A) which corresponds to the steps in FIG. 9A. In some embodiments,then, the inert gas source (712 of FIG. 11) is again turned “ON” toactivate the third solid precursor (1006 of FIG. 11) to introduce athird precursor vapor into the reaction chamber which corresponds to thesteps of FIG. 11. Then, in some embodiments, the oxygen source (716 ofFIG. 9A) is turned on to introduce oxygen vapor into the reaction layerto form the first active layer (114 of FIG. 12) which corresponds to thesteps in FIG. 12.

FIG. 13B illustrates the timing diagram 1300B of some embodimentscorresponding to the second method, comprising a first solid precursor(722 of FIG. 7B) and a second solid precursor (726 of FIG. 7B) asillustrated in FIGS. 7B, 8B, 9B, 10, 11, and 12.

As shown in the timing diagram 1300B of FIG. 13B, in some embodiments,the inert gas source (712 of FIG. 8B) is turned “ON” first to activatethe first solid precursor (722 of FIG. 8B) and the second solidprecursor (726 of FIG. 8B) at the same time which corresponds to thesteps in FIG. 8B. Then, the oxygen source (716 of FIG. 9B) is turned“ON” after the inert gas source (712 of FIG. 8B) to introduce oxygenvapor into the reaction chamber to form the cocktail layer (112 of FIG.9B) which corresponds to the steps in FIG. 9B. In some embodiments,then, the inert gas source (712 of FIG. 11) is again turned “ON” toactivate the third solid precursor (1006 of FIG. 11) to introduce athird precursor vapor into the reaction chamber which corresponds to thesteps of FIG. 11. Then, in some embodiments, the oxygen source (716 ofFIG. 9A) is turned on to introduce oxygen vapor into the reaction layerto form the first active layer (114 of FIG. 12) which corresponds to thesteps in FIG. 12.

In some embodiments, as shown in FIGS. 13A and 13B, the gas pulses donot overlap with one another, besides the activation of the first andsecond solid precursors (722, 726 of FIG. 8B) in FIG. 13B. In some otherembodiments, it will be appreciated that the gas pulses may overlap withone another. For example, in some embodiments, as the inert gas source(712 of FIG. 8B) is not completely “OFF,” the oxygen source (716 of FIG.9B) may turn “ON” such that the gas pulses corresponding to FIG. 8B maypartially overlap with the gas pulse of FIG. 9B.

As illustrated in cross-sectional view 1400 of FIG. 14, in someembodiments, the steps in FIGS. 8A-12 are repeated to form multiplecocktail layers 112 and first active layers 114 over the gate dielectriclayer 108. Thus, in some embodiments, an active structure 110 comprisinga stack of the cocktail layers 112 and first active layers 114 inalternating order are arranged over the gate dielectric layer 108. Insome embodiments, the active structure 110 has a second thickness t₂that is in a range of between, for example, approximately 5 nanometersand approximately 15 nanometers. A bottommost layer 110 b of the activestructure 110 comprises one of the cocktail layers 112. However, in someembodiments, a topmost layer 110 t of the active structure 110 maycomprise one of the cocktail layers 112 or one of the first activelayers 114. It will be appreciated that in some other embodiments, theremay be more or less than 8 layers in the active structure 110.

As illustrated in cross-sectional view 1500 of FIG. 15, in someembodiments, source/drain contacts 118 are formed over the activestructure 110. In some embodiments, the source/drain contacts 118 areformed within an interconnect dielectric layer 116 arranged over theactive structure 110 through various steps comprising depositionprocesses (e.g., physical vapor deposition (PVD), chemical vapordeposition (CVD), PE-CVD, atomic layer deposition (ALD), sputtering,etc.), removal processes (e.g., wet etching, dry etching, chemicalmechanical planarization (CMP), etc.), and/or patterning processes(e.g., photolithography/etching). In some other embodiments, thesource/drain contacts 118 are formed first, and then the interconnectdielectric layer 116 is formed between the source/drain contacts 118 andover the active structure 110.

In some embodiments, the interconnect dielectric layer 116 comprises,for example, a nitride (e.g., silicon nitride, silicon oxynitride), acarbide (e.g., silicon carbide), an oxide (e.g., silicon oxide),borosilicate glass (BSG), phosphoric silicate glass (PSG),borophosphosilicate glass (BPSG), a low-k oxide (e.g., a carbon dopedoxide, SiCOH), or the like. In some embodiments, the source/draincontacts 118 comprise, for example, aluminum, tungsten, copper,tantalum, titanium, or some other suitable conductive material.

Further, in some embodiments, after the formation of the source/draincontacts 118, a post deposition annealing process is to recrystallizethe gate dielectric layer 108 to enhance the polarization states of thegate dielectric layer 108 used to store memory. In some embodiments, thepost deposition annealing process is performed in chamber set to atemperature of between, for example, about 300 degrees Celsius and about500 degrees Celsius for a time period in a range of between, for exampleapproximately 30 seconds and approximately 90 seconds.

In some embodiments, the overall structure formed in FIG. 15 is a thinfilm transistor (TFT) that is also a field effect transistor (FET)ferroelectric random access memory (FeRAM) device. In some suchembodiments, when sufficient signals (e.g., current, voltage) areapplied to the source/drain contacts 118 and the gate electrode 106, achannel region may form in the active structure 110 and near theinterface of the active structure 110 and the gate dielectric layer 108that can read memory from or write memory too the gate dielectric layer108. Because the cocktail layer 112 comprising a mixture of the firstand second materials directly contacts the gate dielectric layer 108,defects are reduced and charge mobility is increased which increases thereliability and switching speeds of the overall FET FeRAM.

FIG. 16 illustrates a flow diagram 1600 of some embodimentscorresponding to the methods illustrated in FIGS. 5-15.

While method in flow diagram 1600 is illustrated and described below asa series of acts or events, it will be appreciated that the illustratedordering of such acts or events are not to be interpreted in a limitingsense. For example, some acts may occur in different orders and/orconcurrently with other acts or events apart from those illustratedand/or described herein. In addition, not all illustrated acts may berequired to implement one or more aspects or embodiments of thedescription herein. Further, one or more of the acts depicted herein maybe carried out in one or more separate acts and/or phases.

At act 1602, a gate electrode is formed over a substrate. FIG. 5illustrates a cross-sectional view 500 of some embodiments correspondingto act 1602.

At act 1604, a gate dielectric layer is formed over the gate electrode.FIG. 6 illustrates a cross-sectional view 600 of some embodimentscorresponding to act 1604.

At act 1606, a cocktail layer is formed over the gate dielectric layerby activating two precursors at one time such that the cocktail layercomprises a mixture of a first material and a second material. FIGS. 8Aand 9A illustrates cross-sectional views 800A and 900A, respectively, ofsome embodiments corresponding to act 1606.

At act 1608, a first active layer is formed over the cocktail layer andcomprises a third material different than the first and secondmaterials. FIGS. 11 and 12 illustrate cross-sectional views 1200 and1300, respectively, of some embodiments corresponding to act 1608.

At act 1610, the forming of the cocktail layer and the first activelayer is repeated to form a stack of cocktail layers and first activelayers alternating with one another over the gate dielectric layer. FIG.14 illustrates a cross-sectional view 1400 of some embodimentscorresponding to act 1610.

At act 1612, a source contact and a drain contact are formed over thestack of cocktail layers and first active layers. FIG. 15 illustrates across-sectional view 1500 of some embodiments corresponding to act 1612.

Therefore, the present disclosure relates to a method of formingcocktail layer comprising a mixture of two materials directly on aferroelectric layer of a FET FeRAM to optimize mobility and surfacestate properties of the cocktail layer and the ferroelectric layer tooptimize switching speeds and reliability of the FET FeRAM.

Accordingly, in some embodiments, the present disclosure relates to anintegrated chip, comprising: a gate electrode arranged over a substrate;a gate dielectric layer arranged over the gate electrode; an activestructure arranged over the gate dielectric layer and comprising a stackof cocktail layers alternating with first active layers, wherein thecocktail layers comprise a mixture of a first material and a secondmaterial, wherein the first active layers comprise a third materialdifferent than the first and second materials, and wherein a bottommostlayer of the active structure is one of the cocktail layers; and asource contact and a drain contact arranged over the active structure.

In other embodiments, the present disclosure relates to an integratedchip comprising: a gate electrode arranged over a substrate; a gatedielectric layer arranged over the gate electrode, wherein the gatedielectric layer comprises a ferroelectric material; an active structurearranged over the gate dielectric layer and comprising a first material,a second material that is different than the first material, and a thirdmaterial that is different than the first and second materials, whereinthe first material and the second material directly contact the gatedielectric layer, and wherein the third material is spaced apart fromthe gate dielectric layer by the first and second materials; and asource contact and a drain contact arranged over the active structure.

In yet other embodiments, the present disclosure relates to a methodcomprising: forming a gate electrode over a substrate; forming a gatedielectric layer over the gate electrode; forming a cocktail layer overthe gate dielectric layer by activating two precursors at one time suchthat the cocktail layer comprises a mixture of a first material and asecond material; forming a first active layer over the cocktail layercomprising a third material different than the first and secondmaterials; and forming a source contact and a drain contact over thecocktail layer and the first active layer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. An integrated chip, comprising: a substrate; agate electrode arranged over the substrate; a gate dielectric layerarranged over the gate electrode; an active structure arranged over thegate dielectric layer and comprising a stack of cocktail layersalternating with active layers, wherein the cocktail layers individuallycomprise a mixture of a first material and a second material, whereinthe active layers comprise a third material different than the first andsecond materials, and wherein a bottommost layer of the active structureis one of the cocktail layers; and a source contact and a drain contactarranged over the active structure.
 2. The integrated chip of claim 1,wherein the gate dielectric layer comprises a ferroelectric material. 3.The integrated chip of claim 1, wherein a topmost layer of the activestructure is one of the cocktail layers.
 4. The integrated chip of claim1, wherein a topmost layer of the active structure is one of the activelayers.
 5. The integrated chip of claim 1, wherein the bottommost layerof the active structure directly contacts the gate dielectric layer. 6.The integrated chip of claim 1, wherein the first material comprisesgallium oxide, the second material comprises indium oxide, and the thirdmaterial comprises zinc oxide.
 7. An integrated chip, comprising: asubstrate; a gate electrode arranged over the substrate; a gatedielectric layer arranged over the gate electrode, wherein the gatedielectric layer comprises a ferroelectric material; an active structurearranged over the gate dielectric layer and comprising a first material,a second material that is different than the first material, and a thirdmaterial that is different than the first and second materials, whereinthe first material and the second material directly contact the gatedielectric layer, and wherein the third material is spaced apart fromthe gate dielectric layer by the first and second materials; and asource contact and a drain contact arranged over the active structure;wherein the first, second, and third materials share a common elementand respectively comprise a first element, a second element, and a thirdelement that are different.
 8. The integrated chip of claim 7, whereinthe active structure comprises a semiconductor material.
 9. Theintegrated chip of claim 7, wherein the active structure comprises astack of first and second layers that alternate with one another,wherein the first layer comprises a mixture of the first and secondmaterials, and wherein the second layer comprises the third material.10. The integrated chip of claim 7, wherein the active structurecomprises multiple layers, and wherein a topmost layer of the activestructure comprises the third material.
 11. The integrated chip of claim7, wherein the active structure comprises multiple layers, and wherein abottommost layer and a topmost layer of the active structure comprise amixture of the first and second materials.
 12. The integrated chip ofclaim 7, wherein the first material has a higher electron mobility thanthe second material.
 13. The integrated chip of claim 7, wherein thefirst material and the second material have amorphous crystalstructures.
 14. The integrated chip of claim 7, further comprising: aninterconnect via arranged below and coupled to the gate electrode; afirst interconnect wire arranged over and coupled to the source contact;a second interconnect wire arranged over and coupled to the draincontact; and an interconnect dielectric structure surrounding theinterconnect via, the first interconnect wire, the second interconnectwire, the source contact, and the drain contact.
 15. An integrated chip,comprising: a gate electrode overlying a substrate; a gate dielectriclayer overlying the gate electrode; a first metal oxide layer comprisinga first metal oxide and a second metal oxide, wherein the first andsecond metal oxides are intermixed and different; a second metal oxidelayer overlying the first metal oxide layer, wherein the second metaloxide layer comprises a third metal oxide different than the first andsecond metal oxides; a source contact and a drain contact overlying thesecond metal oxide layer.
 16. The integrated chip of claim 15, whereinthe third metal oxide is more crystalline than the first and secondmetal oxides.
 17. The integrated chip of claim 15, wherein the firstmetal oxide layer and the second metal oxide layer repeat in analternating pattern from the gate dielectric layer to the source anddrain contacts.
 18. The integrated chip of claim 15, wherein the firstand second metal oxide layers are semiconductor layers.
 19. Theintegrated chip of claim 15, wherein the first metal oxide layercomprises a plurality of regions of the first metal oxide spaced fromeach other by a region of the second metal oxide, and wherein the regionof second metal oxide extends in individual closed paths around each ofthe regions of the first metal oxide.
 20. The integrated chip of claim15, further comprising: a via underlying the gate electrode, between thegate electrode and the substrate.